The components recording process (programming) aims at the programmable components used in electronic circuits for a vast type of products. Any programmable component can be subjected to the HPROM “programming” process.
Programming solution for all types of electronics components, such: Flash Memory, NAND Flash, PLD, EPROM, PROM, MMC, PIC, Logical, Microcontroller, SD Card, Micro SD Card, USB drive.
Use of high productivity and quality programming equipment, providing 100% reliability.
Hprom uses automated machines “Flash Core III” to meet production demands, becoming a reference in agility and productivity.
Programming support for all type of packages: uBGA, FBGA, QFP, uQFP, TQFP, SOP, SOW, SOIC, TSOP, PLCC, DIP
Color system used to identify different version or different products. Many colors are available. (spray pencil) many colors avaliable.
This process is indicated when customer wants to maintain the permanent tracking, with no risk of violation or loss information.
Label used to print customer information and that endures high temperature, it can be submitted to soldering process without damage or loss of the printed information in Label.
The taping and reeling process aims to exchange the components from trays / tubes to the reel, facilitating the assembly process in the “pick and place” machines.
It also helps to reduce the equipment and stock space.
Wide variety of pockets for all types of SMD components, providing packaging solutions.
All types of SMD components can be taped and reeled in order to facilitate the customers’ assembly process.
Baking of electronic devices based on IPC-JEDEC. Moisture-sensitive devices (MSL 3,4,5 and 6) can cause a “void/pop corn” effect when subjected to assembly on the PCB. For this not happen, the components must be within the exposure time. After this period has expired, everything must be submitted to the “Baking” process for correct dehumidification.
Hprom provides repair service on finished products and/or assembled boards.
Our area is 100% free of ESD, and humidity control in accordance with international electronics handling standards.
Our team is prepared to meet any needs for analysis and specified rework by the customer.
Spot Welding, Lead Free Welding, Tin Lead Welding, etc.
Repair, rework, fixing or anything the customer needs we will work to provide.
Visual inspection is used to segregate/identify non-conforming material.
Dry Pack aims to shield components from exposure to moisture and electrostatic discharge (ESD).
Recovery process of lost or damaged balls in components of BGA family. This process guarantees the reuse of the component that would be discarded after removal from PCB and the loss of the balls.
*The reballing process is performed in partnership with a supplier.
